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Auto Pre-sintering Machine
WORKING PRINCIPLE
SW1000 supports automatic silver film stamping and die bonding process. Ag paste process: loading the substrate (with pre-printed silverpaste) to workholder, the bond head picks diefrom wafer, waffle pack or tape, and then placesthe die on the substrate with high temperatureand large bond force to finish the die bondingprocess. For the Ag film application: the bondhead picks the die and moves to the silver filmcarrier to stamp the silver film, then places thedie on the substrate with programmed parame.ters to finish the die bonding process.
Advantages
· Max bonding force 30kgf
· Max bonding temp 250°C
· Gantry system
· Silver film stamping process
· Various input formats
· Supporting upgradation and customization
· Supporting multi chip modules
· User friendly programming interface
SCOPE OF APPLICATION
Handle various input format includingSiC chip, DTS, Cu clip, NTC, RG and etc.
Handle silver film stamping processand die bonding process.
SW1000 supports automatic silver film stamping and die bonding process. Ag paste process: loading the substrate (with pre-printed silverpaste) to workholder, the bond head picks diefrom wafer, waffle pack or tape, and then placesthe die on the substrate with high temperatureand large bond force to finish the die bondingprocess. For the Ag film application: the bondhead picks the die and moves to the silver filmcarrier to stamp the silver film, then places thedie on the substrate with programmed parame.ters to finish the die bonding process.
Advantages
· Max bonding force 30kgf
· Max bonding temp 250°C
· Gantry system
· Silver film stamping process
· Various input formats
· Supporting upgradation and customization
· Supporting multi chip modules
· User friendly programming interface
SCOPE OF APPLICATION
Handle various input format includingSiC chip, DTS, Cu clip, NTC, RG and etc.
Handle silver film stamping processand die bonding process.
Detail