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Auto IGBT Module Bonding Machine
WORKING PRINCIPLE
The loading system automatically loads all the DBC/baseplate to the bonding area. The machine has functional modules to handle wafer, solder preform, tape reel, waffle pack, etc. After loading all the materials and finishing all the pattern recognition, the bondheads pick andplace all the solder preform, die and resistors layer by layer. Once the bonding process is finished, the machine will automatically unloads the the carrier to the oven.
During the die bonding process, both die picking force and placingforce are controlled, whichensures there is no damage on the chip. During the picking the placing process, both downlookoptics and the uplook optics will conduct high precision pattern recognitions to guarantee a highbonding accuracy. The bottom of die and solder preform can be sprayed with alcohol (or otherflux) to ensure that there is no relative movement during the transportation.
The loading system automatically loads all the DBC/baseplate to the bonding area. The machine has functional modules to handle wafer, solder preform, tape reel, waffle pack, etc. After loading all the materials and finishing all the pattern recognition, the bondheads pick andplace all the solder preform, die and resistors layer by layer. Once the bonding process is finished, the machine will automatically unloads the the carrier to the oven.
During the die bonding process, both die picking force and placingforce are controlled, whichensures there is no damage on the chip. During the picking the placing process, both downlookoptics and the uplook optics will conduct high precision pattern recognitions to guarantee a highbonding accuracy. The bottom of die and solder preform can be sprayed with alcohol (or otherflux) to ensure that there is no relative movement during the transportation.
Detail